YAOTAI is your expert partner for custom EMI shielding stamping and EMI shielding fabrication. We deliver precision shielding stamping solutions, including: EMI shielding covers, RFI shielding covers, EMC shielding covers, and PCB shielding covers. Our product range includes the EMI shielding can, shield can, shielding frame, shielding case, and electronic shielding cover for applications like shielding for mobile phones, shielding cover for automotive electronics, EMI shield for telecommunications, GPS antenna shielding, and shielding for medical device PCB. As a premier shielding cover manufacturer, we offer metal stamping for shielding and custom shield can design using Tinplate shield can,Nickel silver rf shield,Beryllium Copper shielding covers, stainless steel shielding covers, Aluminum board level shield and brass shielding covers for high conductivity shielding, spring finger shielding, and EMI gasket shielding with grounding tabs.

Precision Metal Stamping for PCB Shielding in Automotive, Telecommunications, and Consumer Electronics

PCB Shield Cans

Custom-stamped shielding cans for integrated circuits and modules.

RF Shielding for 5G & Telecommunications

Precision shields for base stations, routers, and RF modules.

Design Support & Rapid Prototyping

From Concept to Production: We’re Your Partner

Advanced Manufacturing Capabilities

High-Speed Precision Stamping: Progressive die stamping for high-volume efficiency.

Deep Drawing: For creating seamless, enclosed shielding cavities.

Secondary Operations: Plating, anodizing,soldering,polishing, powder coating, and attachment feature integration.

Quality Assurance: In-house EMI testing (if applicable) and precise dimensional verification.

End-to-End Service: Comprehensive support from design consultation and prototyping to high-volume production.

Material for EMI/RFI Shielding Covers

Material Expertise: Nickel Silver,Tinplate,Aluminum,Beryllium Copper, Stainless Steel, Brass, and other alloys to meet your shielding and mechanical needs.

Nickel silver: can be oxidized, not easy to rust.

Tinplate:can be soldered ,lower price

Aluminum:excellent shielding effectiveness,lightweight and durable, high Corrosion resistance

Beryllium Copper: Excellent for shielding gaskets and spring fingers. High conductivity and fatigue resistance.

Stainless Steel: Great for structural rigidity and corrosion resistance.

Brass: Good general-purpose shielding with good solder ability.

EMI/RF shield with your logo

1. Material: Nickel silver

2.Thickness:0.2mm

3. Dimension: 20x20x10mm

4. Surface treatment: None

5. Process:Progressive Stamping — cutting—- bending

1. Your logo

2. Support holes

3. smooth edge

SHIELD FENCE

1. Material: Tinplate / SPTE

2. Thickness: 0.2mm

3. Surface treatment: None

4. Process: Progressive Stamping

with dimple

nice surface

EMI shield application